What is CoWos(Chip-on-Wafer-on-Substrate)packaging ?
Is a 2.5D and 3D packaging technology, which can be split into "CoW" and "WoS".
CoW (Chip-on-Wafer) means stacking wafers, while WoS (Wafer-on-Substrate) means stacking wafers on a substrate.
Therefore, CoWoS means stacking wafers and packaging them on a substrate, and according to the form of arrangement, it is divided into 2.5D and 3D.
The advantage of this packaging technology is that it can reduce the space of wafers, and at the same time, reduce the power consumption and cost.
The process equipment associated with advanced packaging CoWos is as follows▼
PROBE CARD ▼
Dawon Nexview PROBE CARD ASSEMBLY AUTOMATION,from cutting probes, arrangement, solding, inspection, repair, the equipments required for the entire probe card production line are available in all kinds, provides customers with a one-stop solution.
IC Substrate、Printed circuit board▼
Dawon Nexview LASER SOLDER BALL JETTING SYSTEM is a high-end mass production model that developed for "wafer level packaging", which can achieve perfect bonding of precision components, and the industry's only new repair process greatly reduces scraps and production cost savings.
If you have any questions, please connect us by Email: sales@lhcint.com.tw
