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FCBGA |LASER SOLDER BALL JETTING SYSTEM|Micro bump / Repair Ball mounting / Remove / Reflex |SEMICON Taiwan2025


     The main subject for Semicon Taiwan are Dawon Nexview's laser solder ball jetting system 

  • Dawon Nexview LASER SOLDER BALL JETTING SYSTEM is a high-end mass production model that developed for "wafer level packaging", which can achieve perfect bonding of precision components, and the industry's only new repair process greatly reduces scraps and production cost savings. 
  • Heat only the solder balls, minimizing thermal impact on the substrate(Applications: Co-Packaged Optics (CPO), 3D advanced packaging)

                                          ​


LONG HONG INTERNATIONAL HIGHTECH CO., LTD.(LHC), in addition to occupying a place in the fields of lens optics, precision mold processing and measurement, 5G optical communication, automotive industry, semiconductors, automated probe modules, etc., LHC has been recognized by world-class well-known manufacturers and has become their professional agent.

Our booth I2015 will be grandly exhibited at Taipei Nangang Exhibition Center Hall 1,1st floor,from Semicon Taiwan on September10-12. Zhang Wei-Sen, LHC general manager personally led the elite staffs to receive warmly, and welcome all walks of life to visit and have an in-depth understanding. In addition, exquisite souvenirs  will be presented to the while supplies last.

                                                                  Look forward to seeing you all soon!

 
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LONG HONG INTERNATIONAL HIGHTECH CO., LTD

ADD:3F-3, No.679, Zhongshan Rd., Linkou Dist., New Taipei City 244, Taiwan
TEL:
+886-2-2601-1079/+886-2-2602-2179
FAX:+886-2-2602-3828
EMAIL:sales
@lhcint.com.tw
Wechat: Mars0922660
ADD: 3F-3, No.679, Zhongshan Rd., Linkou Dist., New Taipei City 244, Taiwan
TEL: +886-2-2601-1079
+886-2-2602-217
FAX: +886-2-2602-3828
EMAIL: sales@lhcint.com.tw