Introduction

The Laser Solder Ball Jet System is a precise machine made by Korean company DAWON NEXVIEW. First it separate single solder ball. Then it accurately spray molten tin droplets at a certain temperature to the metalized pads by the combined action of laser and nitrogen. Finally, the heat carried by the solder ball droplets will heat the pads to form bumps or to achieve bonding.
The technique is a type of ball grid array(BGA), and it has the advantages of high density, good heat conduction and low-inductance leads.
 

Process

First, separating and loading the solder ball and then jetting the melted solder ball instantly by high power laser and N2 gas pressure.
 

Applications

For electric connection of micro scale and fine pitch component such as Camera Module, VCM, 3D ToF Module, Type C USB and FOD.

 

Comprehensive Solution

 
 Structural Drawing

 Specification
Speed Max. 6 Balls/sec
Wavelength 1,070nm
Power 100W~200W 
Mode CW, Pulse, ADJ Mode
Ball Size 50um~750um
Laser Life Time 100,000 hours
Repeatability ±5um
Work Area 320mm*320mm
Warranty 2 years
Voltage 220VAC
 
 Machine Real Shot