Introduction
South Korea DAWON NEXVIEW's laser solder ball jet system uses four processes: solder ball loading, solder ball separation, solder ball feeding, and solder ball bumping.
Regarding the soldering method, the sequence is: the solder balls in the solder storage are transported to the disk, and the disk is rotated to separate the solder balls by the centrifugal force.
The separated solder balls pass through a capillary tube, where nitrogen is added to propel the solder balls.
Finally, the laser is synchronized with nitrogen to melt and bump the solder balls to the designated positions.
And it has the Flux post treatment process to optimize the solder balls to ensure the consistency of the appearance and height of the solder balls.
The technology can be applied to Ball Grid Array (BGA for short) and wafer level packaging (WLP for short), and has the advantages of high density, good thermal conductivity, and low inductance pins.
Among the four processes, the most vital thing is solder ball bumping, which is the part that affects the whole soldering the most.
The precision of each axis affects the precision of the solder ball ejection position. In order to enhance the precision, DAWON NEXVIEW is equipped with high-precision driving components and a granite-based platform, and uses a vacuum chuck to adsorb and set the worktable.
In order to make the equipment meet the needs of customers in the advanced process (adding flux, heating, etc.), in addition to the standard processing head (SPH), the advanced processing head (APS) can also be configured separately, which is different from the standard processing head (SPH), Standard head, and can efficiently perform complex operations.
Regarding the soldering method, the sequence is: the solder balls in the solder storage are transported to the disk, and the disk is rotated to separate the solder balls by the centrifugal force.
The separated solder balls pass through a capillary tube, where nitrogen is added to propel the solder balls.
Finally, the laser is synchronized with nitrogen to melt and bump the solder balls to the designated positions.
And it has the Flux post treatment process to optimize the solder balls to ensure the consistency of the appearance and height of the solder balls.
The technology can be applied to Ball Grid Array (BGA for short) and wafer level packaging (WLP for short), and has the advantages of high density, good thermal conductivity, and low inductance pins.
Among the four processes, the most vital thing is solder ball bumping, which is the part that affects the whole soldering the most.
The precision of each axis affects the precision of the solder ball ejection position. In order to enhance the precision, DAWON NEXVIEW is equipped with high-precision driving components and a granite-based platform, and uses a vacuum chuck to adsorb and set the worktable.
In order to make the equipment meet the needs of customers in the advanced process (adding flux, heating, etc.), in addition to the standard processing head (SPH), the advanced processing head (APS) can also be configured separately, which is different from the standard processing head (SPH), Standard head, and can efficiently perform complex operations.
Device application
The solder balls are extremely small and size cover range is 45um~80um.
Common applications for soldering: PC substrates, USB TYPE C connectors and other fields are no longer a problem.
The most notable thing is that this device is a product developed for "wafer packaging". The working table is guaranteed to be able to set up a space for an 8-inch wafer, and there are vacuum chucks specially used to set the wafers.
Common applications for soldering: PC substrates, USB TYPE C connectors and other fields are no longer a problem.
The most notable thing is that this device is a product developed for "wafer packaging". The working table is guaranteed to be able to set up a space for an 8-inch wafer, and there are vacuum chucks specially used to set the wafers.
Product advantages
- High reliability proven fiber laser source
- Independent hight speed digital processor (for high speed and precision laser & pressure control)
- Solder ball feeding safety functions
- High resolution alignment vision with auto focusing
- Customized working table size (quad size/half size substrate or 8-inch wafer table customizable)
- Simple changeover through disk, spacer, capillary
- Various options
- Independent hight speed digital processor (for high speed and precision laser & pressure control)
- Solder ball feeding safety functions
- High resolution alignment vision with auto focusing
- Customized working table size (quad size/half size substrate or 8-inch wafer table customizable)
- Simple changeover through disk, spacer, capillary
- Various options
Specification
Laser source wavelength: 1,070nm
Output power: 30W
Laser life time: Max. 350,000 shot times
Size cover range: 45um~80um
Bumping speed: ≤ 0.4 seconds/piece
Platform reproducibility: ±1um
Working area: 200mm*200mm (can contain 8-inch wafers)
Power voltage: 220VAC
Output power: 30W
Laser life time: Max. 350,000 shot times
Size cover range: 45um~80um
Bumping speed: ≤ 0.4 seconds/piece
Platform reproducibility: ±1um
Working area: 200mm*200mm (can contain 8-inch wafers)
Power voltage: 220VAC
