Saehan Nanotech's Overview ▼
◆ Both Side Spindle Drilling M/C
Hundreds of micro-holes are simultaneously processed on both sides of the silicon electrodeof a
semiconductor wafer to prevent hole misalignment and improve the accuracy between the two holes.
◆Multi Wire Saw M/C-
Highly rigid integrated structure, extremely durable rotating body, suitable for difficult-to-cut materials and large-diametercutting.
LONG HONG INTERNATIONAL HIGHTECH CO., LTD.(LHC), in addition to occupying a place in the fields of lens optics, precision mold processing and measurement, 5G optical communication, automotive industry, semiconductors, automated probe modules, etc., LHC has been recognized by world-class well-known manufacturers and has become their professional agent.
Our booth I2015 will be grandly exhibited at Taipei Nangang Exhibition Center Hall 1,1st floor,from Semicon Taiwan on September10-12. Zhang Wei-Sen, LHC general manager personally led the elite staffs to receive warmly, and welcome all walks of life to visit and have an in-depth understanding. In addition, exquisite souvenirs will be presented to the while supplies last.
Look forward to seeing you all soon!
